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Hot Interconnects 2023 Call for Papers

Important Dates

Paper abstract deadline: Extended - May 19th, 2023
Submission deadline: Extended - May 19th, 2023

Hot Interconnects is the international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia.

The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field. Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. We invite paper submissions across a wide range of topics and levels, ranging from fundamentals to the latest advances in hot topic areas such as:

  • Novel and innovative interconnect architectures
  • Multi-core processor interconnects
  • System-on-Chip Interconnects
  • Advanced chip-to-chip communication technologies
  • Optical interconnects Protocol and interfaces for inter-processor communication
  • Survivability and fault-tolerance of inter-connects
  • High-speed packet processing engines and network processors
  • Systems software for communication
  • System and storage area network architectures and protocols
  • High-performance host-network interface architectures
  • High-bandwidth and low-latency I/O
  • Pb/s switching and routing technologies
  • Innovative architectures for supporting collective communication
  • Novel communication architectures to support cloud & grid computing
  • Centralized and distributed cloud interconnects
  • Requirements driving high-performance interconnects
  • Traffic characterization for HPC systems and commercial data centers
  • Software-defined networking and software overlay networks
  • Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
  • Data Center Networking

Submission​ ​Details

This year we invite papers to be submitted either as regular, long papers (6-8 pages) or as hot topic papers (3-4 pages). Hot topic papers could be positional papers, industry papers, or papers describing hot-off-the-press breaking research results, and will be judged accordingly and independently from the regular long papers.

  • Papers need sufficient technical detail to judge quality and suitability for presentation.
  • Submissions should include title, author, abstract, and paper in double-column, IEEE format.
  • Long paper limit: 8 pages, single-spaced, 2 columns.
  • Hot topic paper limit: 4 pages, single-spaced, 2 columns.
  • Accepted papers (both long and hot topic papers) will be published in proceedings by the IEEE Computer Society.
  • Papers should be submitted electronically through EasyChair

Safety and Well-being: Given the success of previous year’s online format, Hot Interconnects 2023 will continue to be an online conference irrespective of COVID.


Read more about:

Product, HPC, Data centre

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