NEWS
Tags: 

Micron and Intel announce the end of NAND Memory joint development program

Micron and Intel have announced an update to their NAND joint development partnership.

The announcement involves the companies' mutual agreement to work independently on future generations of 3D NAND. The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019.

Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs.

'Micron's partnership with Intel has been a long-standing collaboration, and we look forward to continuing to work with Intel on other projects as we each forge our own paths in future NAND development, said Scott DeBoer, executive vice president of Technology Development, Micron. 'Our roadmap for 3D NAND technology development is strong, and we intend to bring highly competitive products to market based on our industry-leading 3D NAND technology.'

Micron and Intel expect no change in the cadence of their respective 3D NAND technology development of future nodes. The two companies are currently ramping products based on their second generation of 3D NAND (64 layer) technology.

Both companies will also continue to jointly develop and manufacture 3D XPoint at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which is now entirely focused on 3D XPoint memory production.

'Intel and Micron have had a long-term successful partnership that has benefited both companies, and we've reached a point in the NAND development partnership where it is the right time for the companies to pursue the markets we're focused on,' said Rob Crooke, senior vice president and general manager of Non-Volatile Memory Solutions Group, Intel Corporation. 'Our roadmap of 3D NAND and Optane technology provides our customers with powerful solutions for many of today's computing and storage needs.'

Other tags: 
Company: 
Twitter icon
Google icon
Del.icio.us icon
Digg icon
LinkedIn icon
Reddit icon
e-mail icon
Feature

Robert Roe explores the role of maintenance in ensuring HPC systems run at optimal performance

Feature

Robert Roe speaks with Dr Maria Girone, Chief Technology Officer at CERN openlab.

Feature

Dr Keren Bergman, Professor of Electrical Engineering at the School of Engineering and Applied Science, Columbia University discusses her keynote on the development of silicon photonics for HPC ahead of her keynote presentation at ISC High Performance 2018 

Feature

Sophia Ktori explores the use of informatics software in the first of two articles covering the use of laboratory informatics software in regulated industries

Feature

Robert Roe discusses the role of the Pistoia Alliance in creating the lab of the future with Pistoia’s Nick Lynch