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CEA-Leti announces launch of FAMES Pilot Line as part of EU Chips Act Initiative

FAMES initial meeting

Credit: CEA-Leti

The pilot line will develop five new sets of technologies: FD-SOI, several types of embedded non-volatile memory, radio-frequency components, two 3D integration options, and small inductors to develop DC-DC converters for Power Management Integrated Circuits (PMIC)

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