NIST researchers develop photonic chip packaging that can withstand extreme environments
Illustration of a photonic integrated circuit, with components bonded using a technique that enables the circuit to survive and operate in extreme environments.
Credit: NIST
The advance could allow photonic chip-based technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near absolute zero and in scorchingly hot industrial settings
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