Comsol has released Comsol Multiphysics 3.4, a new version of its engineering and scientific software environment for modelling and simulating physical systems. New multicore processor support reduces the time to perform simulations and improves the accuracy of solutions.
It provides fully parallelised meshing for assemblies straight out of the box. A new feature enables users to mesh thermal boundary layers, charged double-layers in AC/DC applications, or viscous boundary layers in fluid-flow applications more efficiently, with greater accuracy, and with less memory consumption than previously possible.
The software includes new fluid dynamic solver methods for simulating very large problems in chemical engineering, heat transfer, or micro-fluidics applications. The software also includes a new suite of post-processing tools to compute the geometric properties of objects.
Improvements to the Chemical Engineering and Heat Transfer Modules allow users to model variable-density flow, multiphase flow and free convection. Other improvements to modules include SPICE-based circuit simulation in the AC/DC Module, and nonlinear parameter estimations in the Reaction Engineering Lab.