CoolIT awarded cool new patent

CoolIT Systems, a provider of direct contact liquid cooling (DCLC) technologies for HPC, cloud and enterprise markets, has been issued with a new patent which covers the company’s Split Flow Heat Exchanger technology.  

The invention of the split flow technology dates back to 2007 and was created as a result of CoolIT R&D efforts to improve liquid cooling performance while reducing pumping power requirements. The result of the invention has been the steady delivery of solutions by CoolIT in the direct contact liquid cooling market. 

‘This is a key patent for the company that adds significantly to our IP portfolio,’ said Geoff Lyon, CEO and CTO of CoolIT Systems. ‘The invention relates to a compact method of delivering coolant through an opening over a central section of micro-channels resulting in a superior level of performance.  This patent strengthens CoolIT’s position with our proprietary technology giving us a tremendous advantage in the market.’

Twitter icon
Google icon icon
Digg icon
LinkedIn icon
Reddit icon
e-mail icon

For functionality and security for externalised research, software providers have turned to the cloud, writes Sophia Ktori


Robert Roe looks at the latest simulation techniques used in the design of industrial and commercial vehicles


Robert Roe investigates the growth in cloud technology which is being driven by scientific, engineering and HPC workflows through application specific hardware


Robert Roe learns that the NASA advanced supercomputing division (NAS) is optimising energy efficiency and water usage to maximise the facility’s potential to deliver computing services to its user community


Robert Roe investigates the use of technologies in HPC that could help shape the design of future supercomputers